Wafer Level UBM Plating
Pac Tech’s fully automatic electroless plating line (PacLine™ Series 200 and 300) allows the processing of 100-300mm wafers with Ni, Pd and Au.
Pac Tech’s fully automatic electroless plating line (PacLine™ Series 200 and 300) allows the processing of 100-300mm wafers with Ni, Pd and Au.
