PacLine 200 M25
Manual Equipment for Electroless Deposition of NiAu, NiPd and NiPdAu
PacLine 200 M25 – is a manual Bumping Line for processing wafers up to 8” with Al or Cu pad metallization.
The modular bumping line consists of a customized numberof process modules, 4 QDR’s and one dryer. The processing of the wafers is done by manual operator handling.
Pac Tech offers a turnkey solution by delivering the equipment and the process chemicals in combination with a technology transfer.
SAW- and Fbar-Filters
Customizable, extensible and adjustable to customer specific design
World wide support team located at Nauen (Germany); Silicon Valley (USA); Penang (Malaysia); Bangkok (Thailand); Shanghai (China, Hsinshu (Taiwan)
Turnkey process solution
Equipment, Process Transfer, Chemistry
Maximum Flexibility for 4”- 8” with no tooling
Flexibility in customer specific requirements/adaptations
|Dimensions L x W x H||depends on customization
L x W x H: approx. 14000 x 1930 x 2400 mm (for NiPdAu and Al & Cu)