PacLine 200 M25

Manual Equipment for Electroless Deposition of NiAu, NiPd and NiPdAu

PacLine 200 M25 – is a manual Bumping Line for processing wafers up to 8” with Al or Cu pad metallization.

The modular bumping line consists of a customized number of process modules, 4 QDR’s and one dryer. The processing of the wafers is done by manual operator handling.

Pac Tech offers a turnkey solution by delivering the equipment and the process chemicals in combination with a technology transfer.

  • Capability for parallel processing of 25 wafers up to 8”
  • Controller for each module (PLC only, no PC)
  • Notooling
Technical Specifications

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