LAPLACE-Can
プローブカード用レーザーリフロー方式ボンダー
微細ピッチのカンチレバー実装を実現します。オプションでリワーク機能つけることが可能です。
LAPLACE-Can (ダウンロード / 製品カタログ)Highlights
- Placement accuracy: +/- ≤ 5µm
- Probe card sizes up to 13 inch
- Full process control
- Alignment control by position bonding
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Cantilever on Probe Card -
Cantilever -
Cantilever Placement -
Probe Card Assembly
Applications
Wafer Probe Cards
Options
Cantilever rework
Benefits
Height control accuracy: ≤ 5µm
Cantilever thickness: 20 – 100µm
Pitch: down to 60µm
Cantilever thickness: 20 – 100µm
Pitch: down to 60µm
Technical Specifications
| Mechanical Data | |
|---|---|
| Dimensions L x W x H | approx. 1520 mm x 1100 mm x 1890 mm |
| Weight: | about 1800 kg |
| Noise: | max. 80dB |
| Electrical Data | |
|---|---|
| Voltage: | AC 230 V +/-5%, 1 phase |
| Max. Current: | 25 A |
| Frequency: | 50/60 Hz |
| Power consumption: | 5750 VA |
| Ancillary Supply | |
|---|---|
| Power consumption: | 5750 VA |
| Air Pressure: | Tube 6/8 bar |
| Laser Unit for Cantilever Bonding | |
|---|---|
| Laser Unit Source: | Diode laser |
| Specs for particular component | |
|---|---|
| Bonding accuracy: | ≤ ± 5µm |
| Cycle time: | ≤ 10 sec |
| Fiducial marks: | Fiducial marks of substrates must be clean etched (Fiducial mark deviation recognition for substrate is not included) |
| Environmental Conditions | |
|---|---|
| Temperature : | 22 +/- 2 °C |
| Relative Humidity: | 45% to 65%, Non Condensing |
| Frequency: | 12 h |
| Cleanroom Recommendation: | Class 10.000 or better |