LAPLACE-Can
Georg Reinecke
LAPLACE-Can
プローブカード用レーザーリフロー方式ボンダー
微細ピッチのカンチレバー実装を実現します。オプションでリワーク機能つけることが可能です。
LAPLACE-Can
(ダウンロード / 製品カタログ)
日本への販売・デモのご依頼はこちら
(お問い合わせ)
- Placement accuracy: +/- ≤ 5µm
- Probe card sizes up to 13 inch
- Full process control
- Alignment control by position bonding
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Cantilever on Probe Card
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Cantilever
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Cantilever Placement
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Probe Card Assembly
Wafer Probe Cards
Cantilever rework
Height control accuracy: ≤ 5µm
Cantilever thickness: 20 – 100µm
Pitch: down to 60µm
| Mechanical Data |
| Dimensions L x W x H |
approx. 1520 mm x 1100 mm x 1890 mm |
| Weight: |
about 1800 kg |
| Noise: |
max. 80dB |
| Electrical Data |
| Voltage: |
AC 230 V +/-5%, 1 phase |
| Max. Current: |
25 A |
| Frequency: |
50/60 Hz |
| Power consumption: |
5750 VA |
| Ancillary Supply |
| Power consumption: |
5750 VA |
| Air Pressure: |
Tube 6/8 bar |
| Laser Unit for Cantilever Bonding |
| Laser Unit Source: |
Diode laser |
| Specs for particular component |
| Bonding accuracy: |
≤ ± 5µm |
| Cycle time: |
≤ 10 sec |
| Fiducial marks: |
Fiducial marks of substrates must be clean etched (Fiducial mark deviation recognition for substrate is not included) |
| Environmental Conditions |
| Temperature : |
22 +/- 2 °C |
| Relative Humidity: |
45% to 65%, Non Condensing |
| Frequency: |
12 h |
| Cleanroom Recommendation: |
Class 10.000 or better |
