LAPLACE-Cap
受動部品実装用レーザーリフロー方式ボンダー
微細な受動部品向けに設計されたレーザーリフロー方式ボンダー。
LAPLACE-Cap (ダウンロード / 製品カタログ)Highlights
- Placement accuracy: +/- ≤ 25µm
- Throughput: 500 capacitors per hour (including soldering)
- No additional reflow process needed
- Requires only a thin layer of solder on the substrate/component pad
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Capacitor Placement -
Capacitors
Applications
Wafer Probe Cards
others
others
Options
SECS GEM Interface
integration in existing FAB software/hardware infrastructure
integration in existing FAB software/hardware infrastructure
Benefits
Capacitor feeder
Pick and place tool with 1µm resolution
Max. capacitor size: 1.25mm x 2.0mm (upgradable to max.: 2.5mm x 2.5mm)
Heating system with temperature controlling (Max. temp.: 150°C, temp. range: +/- 3°C)
Patented laser thermode tool
Bonding direction is 180°
Max. working area: 325mm x 325mm
Pick and place tool with 1µm resolution
Max. capacitor size: 1.25mm x 2.0mm (upgradable to max.: 2.5mm x 2.5mm)
Heating system with temperature controlling (Max. temp.: 150°C, temp. range: +/- 3°C)
Patented laser thermode tool
Bonding direction is 180°
Max. working area: 325mm x 325mm
Technical Specifications
| Mechanical Data | |
|---|---|
| Dimensions L x W x H | approx. 1520 mm x 1100 mm x 1890 mm |
| Weight: | about 1800 kg |
| Noise: | max. 80dB |
| Electrical Data | |
|---|---|
| Voltage: | AC 230 V +/-5%, 1 phase |
| Max. Current: | 6 kVa |
| Frequency: | 60 Hz |
| Power consumption: | Max. 6kW |
| Ancillary Supply | |
|---|---|
| Air Pressure: | 400 kPa (4 kgf/cm³) |
| Air flow rate: | 150 l/min |
| Vision System – Die Detection Unit |
|---|
| Specs for particular component | |
|---|---|
| Bonding accuracy: | ≤ ± 25µm |
| Cycle time: | 12 sec per capacitor (without inspection) |
| Force: | 0.1/1kg (manual adjustable) |
| Capacitor size: | 1 x 0.5 x 0.5mm |
| Capacitor supply form: | Tape/roll |
| Substrate weight: | max. 20kg |
| Substrate thickness: | max. 50mm |
| Size of substrate: | max. 310mm⌀ |
| z-axis: | Travel range max. 50mm |
| Interconnect method: | Laser |
| Fiducial marks: | There are no fiducial marks on the substrate (Alignment will be done on any defined structure) |
| Environmental Conditions | |
|---|---|
| Temperature : | 22 +/- 2 °C |
| Relative Humidity: | 45% to 65%, Non Condensing |
| Frequency: | 12 h |
| Cleanroom Recommendation: | Class 10.000 |