LAPLACE-HT
Georg Reinecke
LAPLACE-HT
高スループットのレーザーリフロー方式全自動ボンダー
LAPLACE-HTはショットキーダイオードとバイパスダイオード（太陽電池モジュール用）の組み立てに適したレーザーリフロー方式全自動ボンダーです。一連のプロセスを自動で実行し、 外観/電気的検査を装置内で行います。
LAPLACE-HT
(ダウンロード / 製品カタログ)
- Reel-to-reel cutting system for metal lead frame
- Pick and place unit for punched metal parts and assembled parts
- High speed paste dispense
- Diode pick up from die feeder
- Laser soldering
- Electrical test
- Optical test
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Punch Unit
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Pick up Difeeder
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Bypass Diode
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Cross Section
Bypass diode assembly for solar cells
Chip on lead frame
RFID
LED assembly
µLED assembly
| Mechanical Data |
| Voltage: |
AC 480 V +/-5%, 3 phase, 5 wires |
| Max. Current: |
80 A |
| Frequency: |
60 Hz |
| Power consumption: |
max. 65 kW |
| CDA Pressure: |
min. 640kPa / 6,4 bar |
| CDA Consumption: |
3500 l/min |
| Laser Unit |
| Laser Unit Source: |
Diode laser 50W |
| Total: |
6 x 3 laser units |
| Customer Delivery |
| e.g. Tray Size: |
500 x 300 Pockets > 96 |
| Punch Unit Material: |
76 mm Thickness 500µm |
| Wafer die size: |
200 – 300 mm |
| Solder Paste: |
6 cartridges 25 cm³ > 95% metal |
| Customization possible |
|
| Specs for particular component |
| Bonding accuracy: |
+-15µm / +-30µm / +-50µm / +-100µm |
| Interconnect method: |
Laser |
