LAPLACE-VC

チップ垂直実装用レーザーリフロー方式ボンダー

“LAPLACE-VC”は基板上にチップを垂直実装するのに適した装置です。

The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate.

Highlights
  • In-Line capability
  • High throughput
  • Rotation correction and automatic alignment
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Benefits
Technical Specifications