LAPLACE-VC
チップ垂直実装用レーザーリフロー方式ボンダー
“LAPLACE-VC”は基板上にチップを垂直実装するのに適した装置です。
LAPLACE-VC (ダウンロード / 製品カタログ)Highlights
- In-Line capability
- High throughput
- Rotation correction and automatic alignment
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Laser Assisted Bonding for
2.5D Flip-Chip & 3D Packaging -
Bond Station -
Applications
Vertical Chip Bonding
Options
Wafer Handling Systems
Dispenser System
Substrate Feeder
Direct Die Feeder
UV Curing
Dispenser System
Substrate Feeder
Direct Die Feeder
UV Curing
Benefits
In-Line capability
High throughput
Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
Vision system
Rotation correction and automatic alignment
90 degree flip unit to present Die to the bonding tool
Temperature control unit
Laser class 1 certified tool
High throughput
Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
Vision system
Rotation correction and automatic alignment
90 degree flip unit to present Die to the bonding tool
Temperature control unit
Laser class 1 certified tool
Technical Specifications
| Mechanical Data | |
|---|---|
| Dimensions L x W x H | approx. 1500 mm x 1200 mm x 2200 mm |
| Additional Clearance: | back & sides: 500mm, front: 1000mm |
| Weight: | about 1800 kg |
| Noise: | max. 80dB |
| Electrical Data | |
|---|---|
| Line Voltage: | 230 V; 1 Phase, 1 Neutral, 1 Ground |
| Max. Current: | 25 A |
| Frequency: | 60 Hz |
| Power consumption: | max. 6kW |
| Ancillary Supply | |
|---|---|
| Air Pressure: | 6 bar |
| Air Flow Rate: | 450 l/min |
| Air Tube Diameter: | 6/8 mm (ID/OD) |
| Nitrogen Pressure: | min. 2 bar; max. 4 bar |
| Nitrogen Rate*): | max. 2 l/min |
| Nitrogen Tube Diameter: | 6/8 mm (ID/OD) |
| Standard vacuum ejector is on board to create the vacuum, this requires compressed air. Optional for substrate handling can integrate Vacuum port to allow usage from the facility. | |
| Laser Unit | |
|---|---|
| Laser SP 120: Power 120W; CW Diode Laser ( object of change based on the process requirements) |
| Vision System – Die Detection Unit | |
|---|---|
| Detection mode: | Gray scale vision system |
| Camera: | ½ inch CCD Camera |
| Other Specs | |
|---|---|
| Bonding accuracy: | +/-25µm (standard); +/-5µm, +/-10µm (optional) |
| Force: | 0.1/10kg (programmable) |
| Chips supply form: | Waffle/Gel pack |
| Cleanroom class: | 10.000 |
| Substrate thickness: | 50µm to 500µm |