LAPLACE-VC
チップ垂直実装用レーザーリフロー方式ボンダー
“LAPLACE-VC”は基板上にチップを垂直実装するのに適した装置です。
LAPLACE-VC (ダウンロード / 製品カタログ) 日本への販売・デモのご依頼はこちら(お問い合わせ)Highlights
- In-Line capability
- High throughput
- Rotation correction and automatic alignment
-
-
Laser Assisted Bonding for
2.5D Flip-Chip & 3D Packaging -
Bond Station
-
Applications
Vertical Chip Bonding
Options
Wafer Handling Systems
Dispenser System
Substrate Feeder
Direct Die Feeder
UV Curing
Dispenser System
Substrate Feeder
Direct Die Feeder
UV Curing
Benefits
In-Line capability
High throughput
Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
Vision system
Rotation correction and automatic alignment
90 degree flip unit to present Die to the bonding tool
Temperature control unit
Laser class 1 certified tool
High throughput
Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
Vision system
Rotation correction and automatic alignment
90 degree flip unit to present Die to the bonding tool
Temperature control unit
Laser class 1 certified tool
Technical Specifications
Mechanical Data | |
---|---|
Dimensions L x W x H | approx. 1500 mm x 1200 mm x 2200 mm |
Additional Clearance: | back & sides: 500mm, front: 1000mm |
Weight: | about 1800 kg |
Noise: | max. 80dB |
Electrical Data | |
---|---|
Line Voltage: | 230 V; 1 Phase, 1 Neutral, 1 Ground |
Max. Current: | 25 A |
Frequency: | 60 Hz |
Power consumption: | max. 6kW |
Ancillary Supply | |
---|---|
Air Pressure: | 6 bar |
Air Flow Rate: | 450 l/min |
Air Tube Diameter: | 6/8 mm (ID/OD) |
Nitrogen Pressure: | min. 2 bar; max. 4 bar |
Nitrogen Rate*): | max. 2 l/min |
Nitrogen Tube Diameter: | 6/8 mm (ID/OD) |
Standard vacuum ejector is on board to create the vacuum, this requires compressed air. Optional for substrate handling can integrate Vacuum port to allow usage from the facility. |
Laser Unit | |
---|---|
Laser SP 120: Power 120W; CW Diode Laser ( object of change based on the process requirements) |
Vision System – Die Detection Unit | |
---|---|
Detection mode: | Gray scale vision system |
Camera: | ½ inch CCD Camera |
Other Specs | |
---|---|
Bonding accuracy: | +/-25µm (standard); +/-5µm, +/-10µm (optional) |
Force: | 0.1/10kg (programmable) |
Chips supply form: | Waffle/Gel pack |
Cleanroom class: | 10.000 |
Substrate thickness: | 50µm to 500µm |