MegaPac 200/300
Georg Reinecke
MegaPac 200/300
PacTechは、標準的な構成のバンピングラインだけでなくカスタマイズ可能なウェットベンチを提供しています。
当社のバンピングラインは、投入/搬出ステーション、クイックダンプリンス用タンク、乾燥用ステーション、および自動Niストリップで構成されています。
PacTechは、装置だけでなく処理液/エンジニアトレーニングを含めたターンキーソリューションをご提供します。
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MegaPac 200/300
(ダウンロード / 製品カタログ)
日本への販売・デモのご依頼はこちら
(お問い合わせ)
- Maximum Flexibility: 4“-12“
- UPH: up to 600,000 wafer per year 8“
- No tooling
- In-line Bath Control and Replenishment
- Total Quality Software for recipe management, process control, data logging
- SECS GEM Interface optional
- Turnkey Process Solution
WLCSP Flip Chip
Discrete Components
Power MOSFET
RFID
SAW- and Fbar-Filters
Optoelectronics
MEMS
SECS GEM Interface
integration in existing FAB software/hardware infrastructure
Total Quality Software for recipe management, process control, data logging
Already installed at leading OEM production sites
World wide support team located at Nauen (Germany); Silicon Valley (USA); Penang (Malaysia); Bangkok (Thailand)
Turnkey process solution
Equipment, Process Transfer, Chemistry
Maximum Flexibility for 4”- 12” with no tooling
Compliant with Semi S2 ; FM 4910 and CE
Flexibility in customer specific requirements/adaptations
Mechanical Data |
Dimensions L x W x H |
approx. 14000 x 1930 x 2400 mm (for NiPdAu and Al & Cu) |
Throughput |
up to 600,000 wafer per hour (8“)
up to 300,000 wafer per hour (12”) |
Control Capabilities |
Parallel processing (same product) of 4 baskets |
each basket à 50 wafers 8’’ or 3 baskets with 20 wafers 12’’ |
Parallel processing (different recipe per each basket, recipes to be provided to PacLine via SECS GEM) of 3 baskets |
each basket à 50 wafers 8’’ or 3 baskets with 20 wafers 12’’ |
Automatic Ni bath control |
Ni Online Analyzer |
Infrastructure requirements/dimensions |
DI water: |
4139 l/h (5-6 bar) |
Cooling water: |
1000 l/h (15°) |
Waste water: |
4180 l/h |
Exhaust: |
60 m³/min |
Compressed Air: |
1025 Lit/min (6 bar) |
Power: |
35 kVA |