Atlanta, USA – The Georgia Tech 3D Systems Packaging Research Center (PRC) integrates the academic faculty, the expert research faculty and industry engineers. It provides support in administration and finance, and facilities such as a complete 300mm cleanroom systems packaging facility. Engineers from the industry are involved in all projects, some on-campus, that are assigned by companies.

PacTech is happy, to be part of a group of 50 other industry members, who make up the global user-to-supply chain Manufacturing Consortium. The unique tools and technologies from Nauen now contribute to R&D for Panel-Based Glass 2.5D and 3D System Interposer Manufacturing.
Glass appears to be the ideal candidate to address the shortcomings of both organic packages and silicon interposers. Smart systems packaging must be panel-based so as to maintain ultra-low cost in spite of ultra-high I/O density.
PacTech USA is now preparing for our first PRC Project: Solder Jet bumps onto a 2.5D glass BGA package.

  • One Graphics Processor Unit- GPU (19 x 20mm).
  • Four memory dies (7.7 x 5.5mm each).
  • 30mm x 40mm substrate: 2745 I/O’s in full array, 500µm balls, on 650µm pitch.
  • Evaluation of new solders to minimize warpage: Manganese-doped SAC solder, and low-temperature alloys.

Other projects planned for 2017, including planarization of molded embedded die packages.