Pac Tech presents SB² Column Stack Equipment at IMAPS San Diego
Pac Techs SB² platform is developed for fast prototyping and rework/reballing on wafer, substrate and package level.
The new SB² -Jet has an option for slim, stacked solder column attach […]
PAC TECH opens Taiwan Application Center for Solder Ball and Jet Platform
During Semicon Taiwan 2012 Pac Tech will demo their new SB²-Jet for Solder Ball Attach and Repair. The modular system can place and laser reflow solder spheres down to 30µm […]