During Semicon Taiwan 2012 Pac Tech will demo their new SB²-Jet for Solder Ball Attach and Repair. The modular system can place and laser reflow solder spheres down to 30µm on wafers and substrates.
The SB²-Jet is a flexible machine platform for automatic Solder Ball Rework with Ball Inspection and Ball Placement on a max. 500mm x 500mm platform. Flux dispense, Laser Reflow, Laser Jetting and Handling for Wafers, Substrates or Single Packages (Trays) are optional.
The machine is applied for:
For more information visit the product experts at booth 405 or 1006 at Semicon Taiwan 2012, TWTC Nangand Hall in Taipei. Semicon Taiwan 2012 will be held September 5-7, 2012.