Pac Techs SB² platform is developed for fast prototyping and rework/reballing on wafer, substrate and package level.
The new SB² -Jet has an option for slim, stacked solder column attach and laser reflow. The machine handles high temperature – high Pb, low temperature InSn, SnBi and standard SAC solder alloys with ball Diameters from 760 down to 30 µm.
The process was developed for high rel packages and substrates used in aerospace and aviation industry. As ITAR Certified supplier, Pac Tech USA offers demo-machines, as well as services and fast prototyping.