• DOWNLOADS
  • CAREERS
  • ABOUT US
  • CONTACT US
    • SALES
    • CUSTOMER SERVICE
  • LANGUAGE
    • en
    • zh-hans
    • ja
PacTech – Packaging Technologies GmbH
  • HOME
  • EQUIPMENT
    • General Overview
    • Wafer Level UBM Plating
    • Solder Jetting
    • Solder Ball Transfer
    • Solder Ball Rework
    • Laser Bonding
    • Wafer Reflow
    • Spin Coating
    • Wafer / Substrate Cleaning
    • Photovoltaic
  • WLP SERVICES
    • General Overview – WLP
    • Solder Bumping
    • Wafer Level Redistribution
    • Flip Chip Test Wafer
      • Test Wafer Pac 2.0
      • Test Wafer Pac 2.3
      • Test Wafer Pac 2.7
    • Wafer Level Photoresist / BCB Coating
    • Wafer Level UBM Plating
      • Electroless Plating
      • Electroplating
    • Wafer Backside Metallization
    • Bonding / Assembly
    • Wafer Thinning
    • Wafer Sawing
    • Die Sort
  • CHEMISTRY
    • Portfolio
    • Analysis Methods
    • Development Roadmap
  • NEWS & EVENTS
    • Press Releases
    • Exhibitions
    • News Overview
  • HOME
  • EQUIPMENT
    • General Overview
    • Wafer Level UBM Plating
    • Solder Jetting
    • Solder Ball Transfer
    • Solder Ball Rework
    • Laser Bonding
    • Wafer Reflow
    • Spin Coating
    • Wafer / Substrate Cleaning
    • Photovoltaic
  • WLP SERVICES
    • General Overview – WLP
    • Solder Bumping
    • Wafer Level Redistribution
    • Flip Chip Test Wafer
      • Test Wafer Pac 2.0
      • Test Wafer Pac 2.3
      • Test Wafer Pac 2.7
    • Wafer Level Photoresist / BCB Coating
    • Wafer Level UBM Plating
      • Electroless Plating
      • Electroplating
    • Wafer Backside Metallization
    • Bonding / Assembly
    • Wafer Thinning
    • Wafer Sawing
    • Die Sort
  • CHEMISTRY
    • Portfolio
    • Analysis Methods
    • Development Roadmap
  • NEWS & EVENTS
    • Press Releases
    • Exhibitions
    • News Overview

Sitemap

  • Home
  • Sitemap
Sitemap Georg Reinecke

News & Events

  • Press Releases
  • Exhibitions
  • News Overview

Contact

Pac Tech –
Packaging Technologies GmbH
Am Schlangenhorst 7 – 9
14641 Nauen – Germany

+49 (0) 3321 4495 – 100
info@pactech.de


NAGASE & CO., LTD.

Newsletter




    • Menu

    • Home
    • Contact Us
    • Terms & Conditions
    • Sitemap
    • Imprint
    • Privacy Policy
    • Facebook

      Facebook

    • Youtube

      Youtube

    • © PacTech - Packaging Technologies GmbH 2019. All Rights Reserved.
    We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.OkRead more