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  • HOME
  • EQUIPMENT
    • General Overview
    • Wafer Level UBM Plating
    • Solder Jetting
    • Solder Ball Transfer
    • Solder Ball Rework
    • Laser Bonding
    • Wafer Reflow
    • Spin Coating
    • Wafer / Substrate Cleaning
    • Photovoltaic
  • WLP SERVICES
    • General Overview – WLP
    • Solder Bumping
    • Wafer Level Redistribution
    • Flip Chip Test Wafer
      • Test Wafer Pac 2.0
      • Test Wafer Pac 2.3
      • Test Wafer Pac 2.7
    • Wafer Level Photoresist / BCB Coating
    • Wafer Level UBM Plating
      • Electroless Plating
      • Electroplating
    • Wafer Backside Metallization
    • Bonding / Assembly
    • Wafer Thinning
    • Wafer Sawing
    • Die Sort
  • CHEMISTRY
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    • Analysis Methods
    • Development Roadmap
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    • News Overview

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Pac Tech –
Packaging Technologies GmbH
Am Schlangenhorst 7 – 9
14641 Nauen – Germany

+49 (0) 3321 4495 – 100
info@pactech.de


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