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PacTech – Packaging Technologies GmbH
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  • HOME
  • EQUIPMENT
    • General Overview
    • Wafer Level UBM Plating
    • Solder Ball Attach
    • Wafer Level Ball Drop
    • Wafer Level Rework
    • Bonding / Assembly
    • Wafer Level Reflow
    • Spin Coating
    • Wafer / Substrate Cleaning
    • Photovoltaic
  • WLP SERVICES
    • General Overview – WLP
    • Solder Ball Attach
    • Wafer Level Redistribution
    • Flip Chip Test Wafer
      • Test Wafer Pac 2.0
      • Test Wafer Pac 2.3
      • Test Wafer Pac 2.7
    • Wafer Level Photoresist / BCB Coating
    • Wafer Level UBM Plating
      • Electroless Plating
      • Electroplating
    • Wafer Backside Metallization
    • Bonding / Assembly
    • Wafer Thinning / Grinding
    • Wafer Sawing / Dicing
    • Tape & Reel
  • CHEMISTRY
    • Portfolio
    • Analysis Methods
    • Development Roadmap
  • NEWS & EVENTS
    • Press Releases
    • Exhibitions
    • News Overview

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Pac Tech –
Packaging Technologies GmbH
Am Schlangenhorst 7 – 9
14641 Nauen – Germany

+49 (0) 3321 4495 – 100
info@pactech.de


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