Wafer / Substrate Cleaning

Pac Tech offers the peripheral equipment associated with electroless plating, including: plasma clean (PlasPac) and megasonic solvent cleaning (MegaPac). The MegaPac MP300A is a system for automatic cleaning of flux residues from wafers after wafer level solder paste printing and solder paste reflow.

PlasPac 200

PacTech / PlasPac / web



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MegaPac 200/300

PacTech / MegaPac / Megasonic / web



more info