MegaPac 200/300
MegaPac 200/300 (Product Brochure Download /.pdf 1MB)Highlights
- Maximum Flexibility: 4“-12“
- UPH: up to 600,000 wafer per year 8“
- No tooling
- In-line Bath Control and Replenishment
- Total Quality Software for recipe management, process control, data logging
- SECS GEM Interface optional
- Turnkey Process Solution
Applications
WLCSP Flip Chip
Discrete Components
Power MOSFET
RFID
SAW- and Fbar-Filters
Optoelectronics
MEMS
Discrete Components
Power MOSFET
RFID
SAW- and Fbar-Filters
Optoelectronics
MEMS
Options
SECS GEM Interface
integration in existing FAB software/hardware infrastructure
integration in existing FAB software/hardware infrastructure
Benefits
Total Quality Software for recipe management, process control, data logging
Already installed at leading OEM production sites
World wide support team located at Nauen (Germany); Silicon Valley (USA); Penang (Malaysia); Bangkok (Thailand)
Turnkey process solution
Equipment, Process Transfer, Chemistry
Maximum Flexibility for 4”- 12” with no tooling
Compliant with Semi S2 ; FM 4910 and CE
Flexibility in customer specific requirements/adaptations
Already installed at leading OEM production sites
World wide support team located at Nauen (Germany); Silicon Valley (USA); Penang (Malaysia); Bangkok (Thailand)
Turnkey process solution
Equipment, Process Transfer, Chemistry
Maximum Flexibility for 4”- 12” with no tooling
Compliant with Semi S2 ; FM 4910 and CE
Flexibility in customer specific requirements/adaptations
Technical Specifications
| Mechanical Data | |
|---|---|
| Dimensions L x W x H | approx. 14000 x 1930 x 2400 mm (for NiPdAu and Al & Cu) |
| Throughput | up to 600,000 wafer per hour (8“) up to 300,000 wafer per hour (12”) |
| Control Capabilities | |
|---|---|
| Parallel processing (same product) of 4 baskets | each basket à 50 wafers 8’’ or 3 baskets with 20 wafers 12’’ |
| Parallel processing (different recipe per each basket, recipes to be provided to PacLine via SECS GEM) of 3 baskets | each basket à 50 wafers 8’’ or 3 baskets with 20 wafers 12’’ |
| Automatic Ni bath control | Ni Online Analyzer |
| Infrastructure requirements/dimensions | |
|---|---|
| DI water: | 4139 l/h (5-6 bar) |
| Cooling water: | 1000 l/h (15°) |
| Waste water: | 4180 l/h |
| Exhaust: | 60 m³/min |
| Compressed Air: | 1025 Lit/min (6 bar) |
| Power: | 35 kVA |