MegaPac 200/300

Pac Tech is offering standard configured and industry proven bumping line’s as well as customized wet benches. The modular bumping line consists of an input/output station, a customized number of process modules, Quick Dump Rinse tanks, drying station and automatic Ni stripping.

Pac Tech offers a turnkey solution by delivering the equipment and the process chemicals in combination with a technology transfer.

MegaPac 200/300 (Product Brochure Download /.pdf 1MB)

  • Maximum Flexibility: 4“-12“
  • UPH: up to 600,000 wafer per year 8“
  • No tooling
  • In-line Bath Control and Replenishment
  • Total Quality Software for recipe management, process control, data logging
  • SECS GEM Interface optional
  • Turnkey Process Solution

Technical Specifications