PlasPac 200
Georg Reinecke
PlasPac 200
Plasma RIE System for Wafer Cleaning and Resist Ashing Processes in Volume
The PlasPac 200 RIE equipment is a versatile batch tool for etching, ashing and cleaning applications in a wide field of microelectronics, packaging, electronics and optics. It provides high throughput, good uniformity, excellent quality and high reliability.
Wafer, single die, PCB and others
SECS GEM Interface
integration in existing FAB software/hardware infrastructure
Maximum Flexibility: 4”, 5”, 6”, 8”, 12”
Process Monitoring and Quality Data Base
Flexible Recipe Management
Cooling Unit: total refrigerating capacity 6 kW
| Mechanical Data |
| Dimensions L x W x H |
approx. 1200 mm x 1300 mm x 2200 mm |
| Weight: |
approx. 1000 kg |
| Parallel Throughput: |
up to 60 Wafer per hour (8”); up to 75 Wafer per hour (4”, 5”, 6”) |
| Electrical Data & Ancillary Supply |
| RF Frequency: |
2.5 kW (500 W per electrode) |
| EX: |
400 V, 3/N/PE AC 50Hz |
| US: |
208 V, 3/N/PE AC 60Hz |
| Main Power Supply: |
11,5 kW |
| Gas supply: |
2-4 mass flow controllers (e.g. O₂, SF₆, Ar); gas shower & pump shields for optimal gas flow uniformity |
| Vacuum Supply: |
Pumping capacity 410 m³/h (50Hz), Ultimate pressure 5E-3mbar |
| Vacuum chamber dimension: |
850 x 850 x 850 mm |
| Infrastructure requirements/dimensions |
| DI water: |
4139 l/h (5-6 bar) |
| Cooling water: |
1000 l/h (15°) |
| Waste water: |
4180 l/h |
| Exhaust: |
60 m³/min |
| Compressed Air: |
1025 Lit/min (6 bar) |
| Power: |
35 kVA |
