PlasPac 200

Plasma RIE System for Wafer Cleaning and Resist Ashing Processes in Volume

The PlasPac 200 RIE equipment is a versatile batch tool for etching, ashing and cleaning applications in a wide field of microelectronics, packaging, electronics and optics. It provides high throughput, good uniformity, excellent quality and high reliability.

PlasPac 200 (Product Brochure Download)

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