PacTech’s Wafer Level Packaging
PacTech’s Electroless Nickel Technology is recognized throughout the industry as the highest quality process with the widest product flexibility. These technologies include: Ni/Au and Ni/Pd for Under-Bump-Metallization, tall Ni/Au for ACF and ACA bumping, and Ni/Au and Ni/Pd/Au for pad re-metallization (OPM for wirebonding).
PacTech offers several technologies for solder deposition including
Single sphere solder jetting using PacTech’s SB² Laser based Bumping tools, and complete wafer bumping using PacTech’s Ultra-SB² Solder Sphere Transfer equipment. The combination of these technologies allows PacTech to provide the widest product offering in the industry; servicing the ASIC, Foundry, Military, Medical, Aerospace, Consumer, Telecommunication, Memory, MEMS, Probe Card, and Hard Disc Drive industries.
To facilitate being a full service provider, PacTech offers a complete set of additional wafer level and backend services, including: sawing, dicing, redistribution, repassivation, backside laser marking, backside coating, test die, and assembly.
In addition, PacTech owns the latest metrology and analytical equipment to help in the development and production processes, including: x-ray, shear test, AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc
e-Ni/Au for ACF and ACA Applications (10-25um)
e-Ni/Au and e-Ni/Pd for OPM (Wirebonding)
Solder Sphere Placement and Jetting (Laser Assisted SB²)
Solder Sphere Transfer (Gang Ball Placement)
Wafer Level Redistribution and Passivation (BCB and WPR)
Backside Laser Marking
Wafer Back Metallization(Ti/Ni/Ag, Ti/Ni/Au and other metals upon request)
AOI & X-ray Inspection
Die Singulation to Tape & Reel
Flip Chip Assembly (Prototyping only)
Backend & Assembly Services
BGA, CSP, LGA, cLCC, QFN
Hard Disc Drives (HGA, HSA)
Bumping service (Brochure download) Questions(Contact us)