With our laser assisted technology we are increasingly asked with the assembly of materials with high variations in physical properties. The assembly of flip chips, SMD components on flexible printed boards shows challenges with regards to the CTE, brittleness and size of all components used in the process. Common processes are thermocompression bonding and or conductive glue attachment.
The laser assisted placement technology allows local heating and hence gives the possibility to react on the CTE mismatch. Additionally the stress on the components is very low thus brittle materials like GaAs or InP can be placed and directly soldered.

For our customers we can offer a process capable of handling different materials in a reliable way, allowing 2.5D and 3D assemblies with highly customized configurations.


Bumping service (Brochure download)

Questions(Contact us)