Flip Chip Test Wafer Pac 2.3
Wafer specifications
- 8“ silicon wafer
– other substrates / semiconductor materials
– on request (e.g. glass, GaAs)
General data
| chip no | chip size / mm | pitch / µm | pad configuration | I/O’s | chips per wafer |
| 3 | 10,0 x 10,0 | 200 / 400 | peripheral | 572 | 241 |
Bump specifications
Available with following bump types
- Electroless Ni/Au (5μm, 10μm, 15μm and 25μm)
for ACF, NCP and ICA adhesive Flip Chip attach - Solder bumps
– SnPb 63/37, SnAg4Cu0,5
– other alloys on request (e.g. PbSn 90/10, AuSn 80/20)
Electrical measurements
- Daisy Chain Structures
- Four Point Kelvin Structures