Flip Chip Test Wafer Pac 2.7
Wafer specifications
- 8“ silicon wafer
– other substrates / semiconductor materials
– on request (e.g. glass, GaAs)
General data
| chip size / mm | pitch / µm | pad configuration |
I/O’s per chip |
chips per wafer | passivation opening |
| 10,0 x 10,0 | 100 | peripheral | 275 | 114 | 60, 50, 40, 30 |
Bump specifications
Available with following bump types
- Electroless Ni/Au (5μm, 10μm, 15μm and 25μm)
for ACF, NCP and ICA adhesive Flip Chip attach - Solder bumps
– SnPb 63/37, SnAg4Cu0,5
– other alloys on request (e.g. PbSn 90/10, AuSn 80/20)
Electrical measurements
- Daisy Chain Structures
- Four Point Kelvin Structures