Pac Tech offers a high quality wafer back metallization process including back grinding and stress relief with TiNiAg qualified for PowerMOSFET and other devices.

Process Flow

E-beam evaporation technology

PacTech Asia uses an e-beam evaporation technology for its wafer backside metallization. The benefits of this technology are speed and low contamination as only the electron beam touches the source material.

PacTech Asia has the capability of coating metals on wafers using the evaporation process with less than 20% variation on the metal thickness (wafer-to-wafer as well as within the overall wafer). This process deposits single or multi-layer of thin metal films on controlled thickness using an electron beam gun (e-gun) evaporation source.

We provide options of mirror and matte finish depending on customer’s requirement.

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