Product Types |
High Volume Wafer Level Solder Bumping High I/O Applications High yield applicatins |
Solder Bump Height | 60 – 760 um |
Smallest Bump Pitch | 80um |
Throughput | 25-30 wafers/hr |
Process Flow
Wafer Level Solder Balling (Ultra-SB²) |
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Turn on Vacuum and Pick Up Solder Spheres |
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Align Head to Pre-Fluxed Wafer |
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Lower Sphere onto Wafer |
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Release Vacuum and Raise Head |
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Reflow |