| Product Types |
High Volume Wafer Level Solder Bumping High I/O Applications High yield applicatins |
| Solder Bump Height | 60 – 760 um |
| Smallest Bump Pitch | 80um |
| Throughput | 25-30 wafers/hr |
Process Flow
| Wafer Level Solder Balling (Ultra-SB²) |
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Turn on Vacuum and Pick Up Solder Spheres
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Align Head to Pre-Fluxed Wafer
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Lower Sphere onto Wafer
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Release Vacuum and Raise Head
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| Reflow |
