Pac Tech has in house design capabilities for photomasks. In order for Pac Tech to layout the redistribution or repassivation, electronic data is often required which locates the position of the bond pads relative to the fiducials. In general Pac Tech can accept electronics files in several formats, including: GDS II data, Gerber, AutoCAD, or DXF. Pac Tech offers different polymers for use in redistribution and repassivation applications. The following table lists the properties of these polymers.
|
BCB (Benzocyclobutene) |
WPR (Filled Epoxy) |
PI (Polyimide) |
|
| Dielectric Constant |
2.65 |
3.7 |
3.4 |
| Dissipation Factor |
0.0008 |
0.030 |
– |
| Tg (ºC) |
>350 |
215 |
255 |
| CTE |
52 |
56 |
73 |
| Tensile Strength (Mpa) |
90 |
90 |
101 |
| Young’s Modulus (GPa) |
2.9 |
2.2 |
2.4 |
| Density (g/cm3) |
1.6 |
– |
– |
|
Elongation (%) |
8 | 6.4 |
18 |
| Water Absorption (%) |
0.2 |
1.5 |
0.6 |
| Thickness (µm ± 1) |
2 -11 |
5 – 25 |
2 – 6 |
| Tone |
Negative |
Negative |
Positive |
|
Cure Temperature (ºC) |
220-250 | 150 |
250-350 |
| Suss Contact Aligner (MA8) | Suss Contact Aligner (MA200) | Blue M Cure Oven (DS266) | Despatch Cure Oven (LCC) |
 |
 |
 |
 |
Bumping service (Brochure download) Questions(Contact us)