Pac Tech offers high quality electro plating processes for Wafer Level RDL for WLCSP, Fine pitch RDL and Copper Pillar. Pac Tech Germany and Pac Tech USA offer the electro plating for low volume with the option to high volume processes at PacTech Asia. PacTech Asia uses a single Wafer Platform as a fully automated tool configurable to optimize capacity. The electro plating processes are supported by Pre-wet, ECD, SRD chambers in high volume configurations. A High Speed Cu plating solution is also available with following capabilities:
- Electro Planting & UBM Etch Semsysco Triton
- Dielectric and Resist Exposure Süss MA200
- Sputtering Tango Axcela
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